Joel Darnauer
joeld@stanford.edu
Cell 650 714 7688
January 2010




I'm interested in game-changing projects
where I can meet smart, energetic people and have a
positive impact on the world.

I'm currently working on a new way of visualizing web traffic.
My long-term vision is to see what users are doing on a planetary scale.


PLACES I'VE BEEN

Google. Hardware/Software Engineer. Grunt. June 2008-Present.


Kiss Me LLC. Founder. Jan 2008-June 2008.


Stanford University, Electrical Engineering. March 2005-Present.


Juniper Networks, Sunnyvale, CA. June, 1999-March, 2005.
Senior Board Design/Signal Integrity Engineer.

Also:


PUBLICATIONS

Journal Articles
 

  • "A Silicon-On-Silicon Field Programmable Multichip Module (FPMCM)---Integrating FPGA and MCM Technologies". Joel Darnauer, Porfirio Garay, Tsuyoshi Isshiki, John Ramirez, Wayne Wei-Ming Dai. IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B. November 1995, Volume 18, Issue 4.
  • "Electrical evaluation of flip-chip package alternatives for next-generation microprocessors". Joel Darnauer, Dave Chengson, Bill Schmidt, Ed Priest, Dave Hanson, and Bill Petefish.  IEEE Transactions on Advanced Packaging, August 1999.

  • Conference Papers

  • "Electrical evaluation of flip-chip package alternatives for next-generation microprocessors". Joel Darnauer, Dave Chengson, Bill Schmidt, Ed Priest, Dave Hanson, and Bill Petefish. 1998 Electronic Components and Packaging Technology Conference.
  • "Tradeoffs in Chip and Substrate Complexity and Cost for Field Programmable Multichip Modules -Part II: The Clique Architecture". Joel Darnauer and Wayne Wei-ming Dai. ASME Interpack. June, 1997.
  • "Tradeoffs in Chip and Substrate Complexity and Cost for Field Programmable Multichip Modules". Joel Darnauer and WayneWei-ming Dai. First Workshop on Innovative Systems In Silicon. October, 1996
  • "A Method for Generating Random Circuits and its Application to Routability Measurement". Joel Darnauer and Wayne Wei-ming Dai. 1996 ACM Symposium on Field Programmable Gate Arrays.
  • "Field Programmable Multi-chip Module: an Integration of FPGA and MCM technology". Joel Darnauer, Porfirio Garay, Tsuyoshi Isshiki, John Ramirez, Wayne Wei-Ming Dai. 1995 Multi-Chip Module Conference.
  • "Design of FPGAs with Area I/O for Field Programmable Multi-chip Module". Vijayshri Maheshwari, Joel Darnauer, John Ramirez, Wayne Wei-Ming Dai. 1995 Symposium on Field Programmable Gate Arrays.
  • "A First-Generation Field Programmable Multichip Module". Joel Darnauer, Porfirio Garay, Tsuyoshi Isshiki, John Ramirez, Wayne Wei-Ming Dai. 1994 IEEE Workshop on FPGAs for Custom Computing Machines.
  • "Fast Pad Redistribution from Periphery-IO to Area-IO". Joel Darnauer and Wayne Wei-Ming Dai. 1994 IEEE Multi-Chip Module Conference.
  • "A 1024-Pin Plastic Ball Grid Array for Flip Chip Die". Andy Switky, Vijay Sajja, Joel Darnauer, Wayne Wei-Ming Dai. 1994 Electronic Components and Technology Conference.

  • Dissertation

  • Cost-Effective Architectures for Field-programmable Multi-chip Modules."  Joel Darnauer.  University of California at Santa Cruz, Computer Engineering Board of Studies, March 1997.

  • Technical Reports

  • "Planar Interchangeable 2-Terminal Routing". UCSC CRL Technical Report 95-49. October, 1995. Man-Fai Yu, Joel Darnauer, and Wayne Wei-Ming Dai.
  • "The Planar Pin-Assignment and Routing Problem is NP-complete". UCSC CRL Technical Report 95-41. August, 1995. Joel Darnauer.